Product introduction:

MAS - H series furnace mainly used for semiconductor devices and power and integrated circuit industries tubular heat wall system of heating device. But with the United States, American TEMPRESS TYAN, American, British, Dutch THERMCO by ASM BTU etc. Various types of diffusion abroad furnace accessories, advanced processing technology and imported materials, processing 2-8 inches wafers spread.
Product features:
Should meet 2-8 "vertical and horizontal wafers spread furnace."
A: Connecticut Sweden heating GaoWenLu styles
A heat preservation material: Britain imported insulation Morgan
A high insulation materials: 99 porcelain insulator braces
Should use temperature - 1300 ℃, 350
Outside shell: stainless steel plate should/aluminum
Aiming at high alumina mouth: zirconium oxide
A temperature control section: 3-9 section temperature control
A: Φ 80mm mouth diameter Φ -- 450mm
A temperature: 100-1600mm
According to customer's requirement, can type furnace lining purity fused tube SiC tubes or

Supply:
According to the structure form into the furnace body, LiShiLu: horizontal
The high temperature of furnace temperature, is divided into: rapid rise cooling furnace and furnace

Small experiment with furnace