DIFFUSION USE
 
        LED ALLOY USE
 
        OXIDATION USE
 
        SOLAR BATTERY
 
        THE HEATER
 
        PECVD
 
        LPCVD
 
        DRYING OVEN
 
        VACUUM USE
 
        SINTERING USE
 
        AUTOMATION
 
        REDUCTION USE
 
   
   
  PECVD

PECVD

Product introduction

Meet semiconductor integrated circuit, the power electronic devices, optoelectronic industry etc used in silicon deposition on 3N4 O2, Si Si Si, phosphorus, Poly - silicon glass and high-borosilicate glass, amorphous silicon and infusible metal silicides etc. Various film technology.

CVD system performance features:
Structure: 1-4 pipe horizontal hot wall type
Specification: silicon wafer 2-8 inches (or 125×125mm, 156×156mm square piece),
Temperature range: 300 ~ 1,100 degrees
Temperature length and precision 200mm: (± 1℃/1000mm - 24h),
Deposition film uniformity: piece of ± 5% within ± 5% between batch of ± 5%
Film thickness: 6-1 5000A
Limiting vacuum system 1Pa superior:
Working pressure range: 20 ~ 133Pa closed-loop control
Control mode: industrial microcomputer
Feeding device: cantilever push-pull boat, a soft landing system
Deposition film classification: Si 3N4 Si02 PSG, Pply, and Si membrane. -
Vacuum pump, Bates: JiXieBeng
Process: 5 and gas/tube. The VCR interface
40KFIz AE high-frequency pulse width modulation (PWM)
Pack piece quantity: 200 / boat

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